Global Die-Attach Materials Market

[Aarti Ghodke]

Global Die-Attach Materials Market was valued US$ XX Mn in 2019 and is expected to reach US$ XX Mn by 2026, at CAGR of XX% during forecast period.

 

The report includes the analysis of impact of COVID-19 lock-down on the revenue of market leaders, followers, and disrupters. Since lock down was implemented differently in different regions and countries, impact of same is also different by regions and segments. The report has covered the current short term and long term impact on the market, same will help decision makers to prepare the outline for short term and long term strategies for companies by region.

 

Die-Attach Materials Market

 

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The die-attach is the method used to bond the semiconductor die with the substrate and the materials used in this process are recognized as die-attach materials. Apart from attaching the die to the substrate, it also provides electrical conductivity between the die and the substrate.

 

The die-attach materials market has some driving factors, such as the rising demand for adhesive in a wide range of applications from industrial to commercial, the technological advancement, and adhesive film with die-attach double functionality boost the global market growth.

 

Additionally, adhesive properties effects such as water absorption and coat strength are advance and are trending in the materials market. However, one of the factors restraining the growth of the die-attach materials market is its functional property mechanical fixation makes its usage limited in the die-attach materials market.

 

The demand for powdered materials is expected to drop in the forthcoming years. Simultaneously, the global sales of paste-based die-attach materials will witness a significant surge during the forecast period. In 2017, above US$ 281 Mn worth die-attach materials in the form of pastes are expected to be sold across the globe.

 

Geographically, Asia-Pacific represents the considerably high market share of XX% and grows with a moderately high CAGR of XX% in the forecast period. North America is experiencing the rapid growth in the attach materials technologies on account of increasing end-use industries including packaging, automation, and other industrial usages. Furthermore, increasing the semiconductor market and advancement in mostly in developing economies of China and India is estimated to boost the growth of the APEJ die-attach materials market.

 

The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding global die-attach materials market dynamics, structure by identifying and analyzing the market segments and project the global market size. Further, the report also focuses on the competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence. The report also provides PEST analysis, PORTER’s analysis, and SWOT analysis to address the question of shareholders to prioritizing the efforts and investment in the near future to the emerging segment in global die-attach materials market.

Scope of the Global Die-Attach Materials Market: Inquire before buying

 

Global Die-Attach Materials Market, By Form Type

 

• Powder
• Paste
• Wires

Global Die-Attach Materials Market, By Material Type

 

• Polymer Adhesives
• Eutectic Die Attach Materials
• Other Material Type

Global Die-Attach Materials Market, By Product Type

 

• Adhesives
• Films
• Sintering
• Solder
• Other Product Type

Global Die-Attach Materials Market, By Region

 

• North America
• Europe
• Asia Pacific
• Middle East and Africa
• South America

Key players operating in Global Die-Attach Materials Market

 

• Dow Corning Corporation
• AI Technology, Inc.
• Henkel AG & Co. KGaA
• Creative Materials Inc.
• Master Bond Inc.
• Alpha Assembly Solutions
• Delo Industrie Klebstoffe GmbH & Co. KGaA
• Indium Corporation
• BE Semiconductor Industries N.V.
• The Dow Chemical Company
• Hybond Inc.

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